The browser you are using is not supported by this website. All versions of Internet Explorer are no longer supported, either by us or Microsoft (read more here: https://www.microsoft.com/en-us/microsoft-365/windows/end-of-ie-support).

Please use a modern browser to fully experience our website, such as the newest versions of Edge, Chrome, Firefox or Safari etc.

AlixLabs wins the IC Taiwan Grand Challenge

A photo of a city skyline.

The NanoLund spin-off company AlixLabs has been selected as a winning entrant from the third batch of the IC Taiwan Grand Challenge, an international competition that recognizes groundbreaking innovations in semiconductor and related technologies.

Out of a highly competitive global field, AlixLabs was selected for its Atomic Layer Etch Pitch Splitting (APS™) technology – a breakthrough equipment solution designed to enable advanced semiconductor manufacturing. This recognition highlights AlixLabs’ role in addressing critical challenges in next-generation chip production, particularly as the industry pushes toward ever-smaller nodes, increasing the need for more energy-efficient solutions.

The IC Taiwan Grand Challenge, organized by Taiwan’s National Science and Technology Council (NSTC), brings together leading technology companies and research-driven startups from around the world. The programme is designed to foster international collaboration, accelerate cutting-edge innovation, and strengthen the global semiconductor ecosystem.

Leading-edge semiconductor manufacturing

“We are honored that the NSTC and the IC Taiwan Grand Challenge jury have deemed AlixLabs and APS™ a winning entry from the pool of 150 participants. This recognition of our technology underlines our belief that it can transform leading-edge semiconductor manufacturing, and there is no better place to do this than in Taiwan,” comments Amin Karimi, COO and R&D Manager at AlixLabs.

AlixLabs joins a distinguished group of finalists from across the United States, Taiwan, South Korea, and Denmark, with the final ceremony held on October 18th at The Taiwan Innotech Expo.